【Technical notes】Crack growth analysis of solder balls
2021.02.09
The design of a semiconductor package requires extremely strict design conditions with the increase in density and performance. The semiconductor package has various failure factors in addition to the problem of the basic thermal stress analysis. This document introduces a macro specialized for crack growth analysis of solder due to thermal cycle fatigue.
This solution will help you better solve below problems during your development:
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Analysis considering the effect of thermal cycle fatigue of solder
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Conduct solder crack growth analysis
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Implementation of analysis considering solder creep characteristics
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[C34]Crack growth analysis of solder balls
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2021-02-09 10:34:00
2021-02-09 10:34:00 |
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