|
Ansys Sherlock is a simulation analytical software aiming to measure PCB reliability and fatigue life. It can take the function and feature design of the products into consideration and evaluate the possible failure of the components and their corresponding fatigue life within the service life for circuit products under dynamic work conditions and applications.
|
.png) |
|
Applicable fields:
When a reliability simulation analytical report under GMW3172 is required. When better product safety and durability need to be achieved. |
.png) |
With the Ansys Sherlock software, the relevant results can be quickly obtained through the following procedure:
- Import of the ECA files
- Environment configuration and component definition
- Reliability analysis type and simulation result output.
.png)
Ansys Sherlock analysis process diagram
Import of the ECAD files
Based on the existing PCV design software (e.g.: Cadence Allegro PCB, Mentor PADS / Expedition / Boardstation / Zuken / Altium / Protel, etc.), ODB++ files with industrial standards can be exported, which can be directly imported into Ansys Sherlock.
Environment configuration and component definition
The reason why Ansys Sherlock can accurately evaluate the fatigue life of the various components in PCBs is that it has more than thirty thousand types of the latest material database, which includes: Embedded / Populated / Modifiable Libraries (Local & Global) Parts/Package/Laminates/Materials/Solder. This not only offers the users a quick understanding of the parameters that affected the simulation results but also a more convenient and transparent material content for modification; it allows models closer to the real product through the information given by the users.
Part List component definition and packaging selection
.png)
PCB Stackup material information and definition
Reliability analysis type and simulation result output
Reliability analysis type
Ansys Sherlock’s reliability simulation analytical functions:
-
Analysis of solder fatigue caused by thermal cycling.
-
Analysis of PTH fatigue: plated through-hole fatigue caused by thermal cycling.
-
Analysis of harmonic vibration.
-
Analysis of random vibration.
-
Analysis of mechanical shock.
-
Design failure mode and effects analysis(DFMEA).
-
CAF analysis: conductive anodic filament.
Among them, solder fatigue, random vibration, and mechanical shock are analyses items often required by GMW3172.
Simulation result output – lifetime and failure probability prediction curve
Ansys Sherlock can calculate the probability of failure and lifetime generated by each analysis, including random vibration, solder fatigue, PTH fatigue, mechanical shock, etc. It can compile the different results and obtain the overall probability of failure.
.png)
PCB fatigue life prediction curve
Simulation result output - Individual component result list
Apart from the prediction curve, it can observe the failure results and life of each component, allowing the users to quickly find out components with higher risks and to adopt enhancement measures for them.
.png)
component output result list
Simulation result output – Automatic report generation
When the users complete the aforementioned analyses, relevant reports can be quickly compiled, which can not only be provided directly to customers who need Ansys Sherlock reports but also save time for screenshots, drawing, and layout.
.png)
Ansys Sherlock automatically generates reports
