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Ansys Icepak

Ansys Icepak offers powerful electronic cooling solutions by using the leading Ansys fluent computational fluid dynamics (CFD) solver to analyze the heat and fluid flow of integrated circuits (IC), packaging, printed circuit boards (PCB), and electronic components. The Ansys Icepak CFD solver uses Ansys Electronics Desktop (AEDT) graphical user interface (GUI), offering the engineers a CAD-centered solution where they can easily use the functional operation interface to manage heat problems within the same unified framework of Ansys HFSS, Ansys Maxwell, and Ansys Q3D Extractor.Electrical and mechanical engineers who work within this environment can enjoy a fully automatic design process by connecting Ansys HFSS, Ansys Maxwell, and Ansys Q3D Extractor with Ansys Icepak for the steady-state or transient state thermal analysis.
The engineers can rely on Ansys Icepak to provide integrated electronic cooling solutions for electronic applications. The scope ranges from a single IC, packaging, and PCB, to the system shell and even entire data centers. Everything is included. Ansys Icepak solver performs analyses for conduction, convection, and radiation conjugate heat transfer. It has various advanced functions, which can not only conduct modeling for laminar and turbulent flows but also site analysis for radiation and convection. Ansys Icepak offers a large database of fans, heat dissipators, and materials, providing different solutions for daily electronic cooling problems.

Product features

The comprehensive design process with multiple physics fields
The Ansys Electronics Desktop (AEDT) platform allows the engineers to connect Ansys Icepak with Ansys HFSS, Ansys Q3D Extractor, and Ansys Maxwell dynamically to obtain the heat solution. Before performing the steady-state and transient state thermal analysis, you can easily reflect the power loss of the EM tool to your design with just a click. You can also integrate the power integrity analysis in Ansys SIwave with the thermal analysis in Ansys Icepak.


ECAD-MCAD import
To speed up model development, Ansys Icepak can import electrical CAD (ECAD) and mechanical CAD (MCAD) data from various sources. Ansys Icepak can directly support files created with EDA software (such as Altium Designer, Cadence®, Zuken®, Sigrity®, Synopsys®, ODB++, IPC2581, and MentorGraphics®), as well as the import of STEP and IGES files into MCAD models. Ansys SpaceClaim allows Ansys Icepak to import geometry from all the major MCAD software through Ansys Workbench geometric port. The geometry imported from ECAD and MCAD can be integrated into one model, enabling the effective creations of electronic assembly models.


Convenient meshing and modeling tool
Ansys Icepak can automatically mesh while allowing you to customize the meshing parameters to improve and weigh between the cost and the resulted accuracy. The sliding track mesh configuration tool allows you to conduct more refined meshing for objects with higher temperature and velocity gradients, and less refined mesh for objects with smaller gradients. All these functions allow suitable mesh for heat analysis to be created easier. Also, ECAD and MCAD can be integrated within the operational space in the same analysis project, offering a heat dissipation solution for the complete product design. 


The vast object and tool model library
Ansys Icepak’s database contains a large amount of material integration which can be assigned for surface, solids, and fluids. By introducing MCAD and ECAD design, Ansys Icepak offers simplified solutions centered on electrothermal CAD of multiple physics fields. The automatic CAD geometric graphic cleaning and repair functions, as well as other editing options, make the simulation configuration and analysis very easy to achieve. Designers can easily utilize the tool model library, which contains a large amount of Ansys Icepak 3D fans and heat dissipators, to solve typical heat dissipation problems.


Electrothermal analysis optimization
Ansys Icepak uses Ansys Optimetrics to provide "assumed conditions" and design of experiments (DoE) analysis of local parameters of the geometry, materials, and power loss. For instance, when there’s a change of current as you change the drill size, pad size, and/or PCB through-hole, you can easily calculate the electrothermal impact. The Maxwell-Icepak electrothermal analysis can easily solve the eddy current effects of transformers and coils, ensuring maximum accuracy within the easy-to-use and intuitive graphical user interface.


Visualized post-processing
Ansys Icepak software contains a complete set of qualitative and quantitative post-processing tools that can generate meaningful graphics, animations, and reports, allowing users to easily send the simulation results to their colleagues and customers. The velocity vector, temperature profile, fluid-particle trajectory, isosurface display, cutting plane, and the visualized XY graph of result data, can all be used to explain the results of the electronic cooling simulation. Custom reports that include graphics can be generated automatically, which can be used to distribute the result data, identify the simulation trend, and report the operation points of the fans and blowing engines. Ansys CFD-Post, the program used as an advanced post-processing and animation tool, is included in Ansys Icepak.
Simple intuitive interface
The interface of the function section in Ansys Icepak can provide rich and user-friendly experiences. The Ansys Icepak in AEDT supports Iron Python script with automatic recording and replay functions. It offers script functions of local JAVA, VB, and Iron Python. The script and log functions in Ansys Icepak are very useful for automated daily analyses or long and tedious tasks during the design process.
  • Circuit analysis
  • Block diagram simulation
  • State machine simulation
  • VHDL-AMS analysis
  • The integrated graphical modeling environment
  • Characterization of power electronic equipment and modules
Model library:
  • Power electronic components
  • Control block and sensor
  • Mechanical parts
  • Hydraulic components
  • Digital and logic blocks
Application database:
  • Aviation and aerospace electronic network
  • Electric vehicles
  • Power system
  • Featured manufacturer’s components
  • Reduced-order modeling