Thermal and Structural Integration Applications

The seminar will focus on two main areas — thermal-fluid and structural simulations, demonstrating how engineers can leverage Ansys simulation solutions to optimize designs and improve product reliability across multiple levels, from chip packaging and electronic modules to process equipment.

This is a CYBERNET TAIWAN webinar presented in Mandarin with English slides and subtitles (Closed Captions). Please select your preferred Caption Language after joining the webinar.

1. Select Closed Captions from the Webex menu.
2. Select Caption Language and choose preferred language.

We also recommend the Webex desktop version for the best experience.

Webinar Schedule

5 December 2025, from 4:00 PM - 5:00 PM CST
Online event

Key Takeaways

• Chip & Package Thermal Analysis: Key heat transfer and cooling design insights.
• Airflow & Thermal Optimization: Improve module and equipment cooling efficiency.
• Structural & Thermal Stress: Predict deformation and fatigue life.
• Integrated Simulations: Combine thermal-fluid and structural analyses for realistic design validation.
• Case Studies: Best practices from Ansys software implementations.

Registration

CYBERNET SYSTEMS MALAYSIA SDN.BHD. is an Ansys Authorized Channel Partner in Malaysia, Singapore, Thailand, Vietnam, and other ASEAN countries.

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