AbstractCo-packaged optics (CPO) represents a key enabling technology for high-bandwidth, energy-efficient data communication in advanced semiconductor systems. By combining optical, thermal, and electromagnetic analyses, key aspects such as optical coupling efficiency, thermal management, signal integrity, and packaging constraints can be addressed within a unified workflow. The Multiphysics simulation-driven design ultimately reduces development risk, accelerates decision-making, and maximizes bandwidth density. Attendees will gain valuable insights into applying Ansys Photonic and Multiphysics solutions to create manufacturable, high-performance co-packaged optics for advanced semiconductor applications, including data centers, AI, and HPC systems. |
Product HighlightsAnsys offers AI-powered CAE solutions with powerful multiphysics analysis capabilities for semiconductor and other high-tech industries.
|
|
|
CYBERNET SYSTEMS MALAYSIA SDN.BHD. is an Ansys Authorized Channel Partner in Malaysia, Singapore, Thailand, Vietnam, and other ASEAN countries. |
|
CYBERNET is not affiliated with the host entity.
Any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans such as Ansys, CFX, Fluent are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries.
All other brand, product, service and feature names or trademarks are the property of their respective owners.